Method to recover patterned semiconductor wafers for rework

Details Method to recover patterned semiconductor wafers for rework Method to recover patterned semiconductor wafers for rework

2008-02-15

2011-10-11

Vinh, Lan (Department: 1713)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S691000, C216S088000, C451S038000

Reexamination Certificate

active

08034718

ABSTRACT:
Disclosed are embodiments of a method of removing patterned circuit structures from the surface of a semiconductor wafer. The method embodiments comprise blasting the surface of the semiconductor wafer with particles so as to remove substantially all of the patterned circuit structures. The blasting process is followed by one or more grinding, polishing and/or cleaning processes to remove any remaining circuit structures, to remove any lattice damage and/or to achieve a desired smoothness across the surface of the semiconductor wafer.

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U.S. Appl. No. 11/609,573, Codding, et al., Pending.
U.S. Appl. No. 11/623,354, Codding, et al., Pending.

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