4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Steven Lewis Wille

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Method and assembly for providing improved underchip encapsulati

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent

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Method and assembly for providing improved underchip encapsulati

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Method and assembly for providing improved underchip...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Method of holding a component using an anhydride fluxing agent

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Microelectronic assembly including a decomposable encapsulant, a

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Profile ID: LFUS-PAI-P-523079

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