Microelectronic assembly including a decomposable encapsulant, a

Details Microelectronic assembly including a decomposable encapsulant, a Microelectronic assembly including a decomposable encapsulant, a

1998-07-21

1999-07-27

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438106, 257737, 257738, 257686, 257778, H01L 2328

Patent

active

059305983

ABSTRACT:
A microelectronic assembly (10) includes an integrated circuit component (14) spaced apart from a substrate (12) by a gap filled with a polymeric encapsulant (18). The polymeric encapsulant (18) contains a thermally decomposable azide group. In the event that it is necessary to remove the component (14), such as if the component (14) is found to be defective, the microelectronic assembly (10) is heated to a temperature above the decomposition temperature of the azide group. Decomposition of the azide group disintegrates the encapsulant (18) and preferably detaches the component from the substrate (12), thereby permitting replacement of the component (14).

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Suryanarayana, et al. "Repairability of Underfill Encapsulated Flip-Chip Packages", 45th Electronic Components & Technology Congerence, May 21, 1995.
Lewis, Richard, "Hawleys' Condensed Chemical Dictionary", Van Nostrand Reinhold Company, 1993, p. 108, No Month.
Suryanarayana, et al. "Repairability of Underfill Encapsulated Flip-Chip Packages", 45th Electronic Components & Technology Conference, May 21-24, 1995.
3M, "GAP-5527 Polyol Brochure", Issued Jun. 1994.

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