Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-05-03
1998-01-06
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29841, 22818022, 228223, H05K 334, H05K 330
Patent
active
057041164
ABSTRACT:
A solution (20) is dispensed onto bond pads (18) on a substrate (14). An integrated circuit component (12) that includes solder bumps (16) formed on component bond pads (30) is superposed onto the substrate (14) such that the solder bumps (16) rest against the bond pads (18). The solution (20) includes an anhydride compound that acts as a fluxing agent. The subassembly (11) is heated to a temperature sufficient to bond the solder bumps (16) to the bond pads (18) to form solder bump interconnections (26). During the bonding process, the fluxing agent substantially vaporizes and leaves virtually no residue on the substrate (14) to allow the component (12) to be effectively underfilled with a polymeric encapsulant (24).
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Gamota Daniel Roman
Hertsberg Michael
Scheifers Steven Michael
Wille Steven Lewis
Echols P. W.
Fekete Douglas D.
MacIntyre John B.
Motorola Inc.
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