4. Metal fusion bonding
  5. Solder form

Stephen S. Drofitz, Jr.

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Determination of electric current flow patterns

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – Frequency of cyclic current or voltage
Patent

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Hermetic CBGA/CCGA structure with thermal paste cooling

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Method for bonding heatsink to multiple-height chip

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Multi-chip heat-sink cap assembly

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Multi-chip module and heat-sink cap combination

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1012703

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