Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1997-07-29
1999-11-23
Reichard, Dean A.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257713, 257778, H01L 2302
Patent
active
059904186
ABSTRACT:
A device and method for hermetically sealing an integrated circuit chip between a substrate and a lid while providing effective dissipation of heat generated by the integrated circuit chip. The device includes an integrated circuit chip, carrier substrate, interface coolant, and a lid. The integrated circuit chip is attached to the top of the carrier substrate. The interface coolant is disposed on the top of the integrated circuit chip and the lid is placed on top of the carrier substrate/integrated circuit chip combination and contacts the interface coolant. The interface coolant provides a thermal path for conducting heat from the integrated circuit chip to the lid. The substrate is attached to a circuit board by a ceramic ball grid array (CBGA) or a ceramic column grid array (CCGA).
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Bivona Kevin G.
Coffin Jeffrey T.
Drofitz, Jr. Stephen S.
Goldmann Lewis S.
Interrante Mario J.
International Business Machines - Corporation
Ngo Hung V
Reichard Dean A.
Townsend Tiffany L.
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