Multi-chip heat-sink cap assembly

Details Multi-chip heat-sink cap assembly Multi-chip heat-sink cap assembly

1998-01-22

1999-11-09

Booth, Richard

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438122, H01L 2144, H01L 2148, H01L 2150

Patent

active

059813105

ABSTRACT:
A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.

REFERENCES:
patent: 4034468 (1977-07-01), Koopman
patent: 4034469 (1977-07-01), Koopman et al.
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4607277 (1986-08-01), Hassan et al.
patent: 4654966 (1987-04-01), Kohara et al.
patent: 4825284 (1989-04-01), Soga et al.
patent: 4920574 (1990-04-01), Yamamoto et al.
patent: 5081067 (1992-01-01), Shimizu et al.
patent: 5126919 (1992-06-01), Yamamoto et al.
patent: 5276586 (1994-01-01), Hatsuda et al.
patent: 5325265 (1994-06-01), Turlik et al.
patent: 5396403 (1995-03-01), Patel
patent: 5753529 (1998-05-01), Chang et al.

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