4. Coating processes
  5. Electrical product produced
  6. Condenser or capacitor

Stephan Alan Cohen

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Chip interconnect wiring structure with low dielectric...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Chip interconnect wiring structure with low dielectric...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Diamond-like carbon for use in VLSI and ULSI interconnect system

Etching a substrate: processes – Gas phase etching of substrate – Etching a multiple layered substrate where the etching...
Patent

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Diamond-like carbon for use in VLSI and ULSI interconnect system

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Diffusion barrier layer and semiconductor device containing...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Profile ID: LFUS-PAI-P-646550

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