Diamond-like carbon for use in VLSI and ULSI interconnect system

Details Diamond-like carbon for use in VLSI and ULSI interconnect system Diamond-like carbon for use in VLSI and ULSI interconnect system

1995-06-07

1997-10-07

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566361, 1566431, 216 79, 216 81, 437228, H01L 21306

Patent

active

056743556

ABSTRACT:
The present invention relates to semiconductor devices comprising as one of their structural components diamond-like carbon as an insulator for spacing apart one or more levels of a conductor on an integrated circuit chip. The present invention also relates to a method for forming an integrated structure and to the integrated structure produced therefrom. The present invention further provides a method for selectively ion etching a diamond-like carbon layer from a substrate containing such a layer.

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