4. Compositions: ceramic
  5. Ceramic compositions
  6. Glass compositions, compositions containing glass other than...

Srinivasa S. N. Reddy

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Alignment verification for C4NP solder transfer

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Bonding of pure metal films to ceramics

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Making composite or hollow article
Patent

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Ceramic substrate having a sealed layer

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent

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Ceramic via composition, multilayer ceramic circuit containing s

Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent

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Ceramic via composition, multilayer ceramic circuit containing s

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Metal and nonmetal in final product
Patent

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Profile ID: LFUS-PAI-P-51296

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