Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1992-05-29
1994-08-09
Lieberman, Paul
Compositions
Electrically conductive or emissive compositions
Free metal containing
252512, 75228, 75255, 75246, 75247, 106 112, 106 118, 106 125, 106 126, 420485, 420487, 420582, 420587, H01B 100, H01B 102
Patent
active
053364449
ABSTRACT:
A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.
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Casey Jon A.
Divakaruni Renuka S.
Natarajan Govindarajan
Reddy Srinivasa S. N.
Sammet Manfred
Blecker Ira David
International Business Machines - Corporation
Kopec M.
Lieberman Paul
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