Ceramic via composition, multilayer ceramic circuit containing s

Compositions – Electrically conductive or emissive compositions – Free metal containing

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252512, 75228, 75255, 75246, 75247, 106 112, 106 118, 106 125, 106 126, 420485, 420487, 420582, 420587, H01B 100, H01B 102

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active

053364449

ABSTRACT:
A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

REFERENCES:
patent: 4140817 (1979-02-01), Brown
patent: 4234367 (1980-11-01), Herron et al.
patent: 4409261 (1983-10-01), Kuo
patent: 4493789 (1985-01-01), Ueyama et al.
patent: 4540604 (1985-11-01), Siuta
patent: 4594181 (1986-06-01), Siuta
patent: 4619836 (1986-10-01), Prabhu et al.
patent: 4687597 (1987-08-01), Siuta
patent: 4695403 (1987-09-01), Nishimura et al.
patent: 4714570 (1987-12-01), Nakatani et al.
patent: 4880684 (1989-11-01), Boss et al.
patent: 4919643 (1990-03-01), Williams
patent: 4937016 (1990-06-01), Suehiro et al.
patent: 5011725 (1991-04-01), Foster
patent: 5167869 (1992-12-01), Nebe et al.
Abstract of JP 2-197013 publish. Aug. 1990.
Research Disclosure, No. 316, Aug. 1990, Emsworth GB, XP 000141001 31695, "Formation of Bismuth Containing Cu Vias in Ceramic Packages".
IBM Technical Disclosure Bulletin, vol. 27, No. 4B, Sep. 1984, p. 2658, S. Wen, "Metal Paste Composition for Glass-Ceramic Copper System".

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