Ceramic via composition, multilayer ceramic circuit containing s

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Metal and nonmetal in final product

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

419 36, 419 45, 419 53, 419 54, 427123, 4271261, B22F 708

Patent

active

054684455

ABSTRACT:
A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

REFERENCES:
patent: 4234367 (1980-11-01), Herron et al.
patent: 4409261 (1983-10-01), Kuo
patent: 4493789 (1985-01-01), Ueyama et al.
patent: 4540604 (1985-11-01), Siuta
patent: 4594181 (1986-06-01), Siuta
patent: 4619836 (1986-10-01), Prabhu et al.
patent: 4687597 (1987-08-01), Siuta
patent: 4714570 (1987-12-01), Nakatani et al.
patent: 4863683 (1989-09-01), Nakatani et al.
patent: 4880684 (1989-11-01), Boss et al.
patent: 4910643 (1990-03-01), Williams
Research Disclosure, No. 316, Aug. 1990, Emsworth GB, XP 000141001 31695, "Formation of Bismuth Containing Cu Vias in Ceramic Packages".
IBM Technical Disclosure Bulletin, vol. 27, No. 4B, Sep. 1984, p. 2658, S. Wen, "Metal Paste Composition for Glass-Ceramic Copper System".

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ceramic via composition, multilayer ceramic circuit containing s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ceramic via composition, multilayer ceramic circuit containing s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic via composition, multilayer ceramic circuit containing s will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1135048

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.