4. Metal fusion bonding
  5. With means to juxtapose and bond plural workpieces
  6. Wire lead bonder

Sreenivasan K. Koduri

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Alignment apparatus for wire bonding capillary

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent

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Back side coating of semiconductor wafers

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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Bumpless wafer scale device and board assembly

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Bumpless wafer scale device and board assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Capillary holder for wire bonding capillary

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent

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Profile ID: LFUS-PAI-P-966147

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