Method and apparatus for no lead semiconductor package

Details Method and apparatus for no lead semiconductor package Method and apparatus for no lead semiconductor package

2008-05-22

2011-11-22

Lee, Eugene (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S670000, C257S676000, C257S690000, C257SE23031, C257SE23034, C257SE23061, C257SE23124

Reexamination Certificate

active

08063470

ABSTRACT:
A leadframe for use in fabricating a no lead semiconductor package contains connecting bars between individual electrical contact pads. For embodiments having a die pad, the leadframe further includes connecting bars between the contact pads and the die pad. The lower surfaces of the connecting bars are coplanar with the lower surfaces of the contact pads and/or the die pad, and the upper surfaces of the connecting bars are recessed with respect to the upper surfaces of the contact pads and/or the die pad. The semiconductor package is fabricated by encapsulating the die and the leadframe in a molding compound and then removing the connecting bars. The leadframe is typically formed by half etching a metal sheet to form the connecting bars. The connecting bars are removed from the encapsulated package by a selected cutting, sawing, or etching means, based on a predetermined pattern.

REFERENCES:
patent: 3391383 (1968-07-01), Antes
patent: 3611061 (1971-10-01), Segerson
patent: 4411719 (1983-10-01), Lindberg
patent: 4501960 (1985-02-01), Jouvet et al.
patent: 4713611 (1987-12-01), Solstad et al.
patent: 4757255 (1988-07-01), Margozzi
patent: 4766371 (1988-08-01), Moriya
patent: 4779047 (1988-10-01), Solstad et al.
patent: 4801561 (1989-01-01), Sankhagowit
patent: 4855672 (1989-08-01), Shreeve
patent: 4871965 (1989-10-01), Elbert et al.
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5008615 (1991-04-01), Littlebury
patent: 5142449 (1992-08-01), Littlebury et al.
patent: 5247248 (1993-09-01), Fukunaga
patent: 5248075 (1993-09-01), Young et al.
patent: 5396185 (1995-03-01), Honma et al.
patent: 5397921 (1995-03-01), Karnezos
patent: 5479105 (1995-12-01), Kim et al.
patent: 5535101 (1996-07-01), Miles et al.
patent: 5548884 (1996-08-01), Kim
patent: 5578919 (1996-11-01), Semba et al.
patent: 5596231 (1997-01-01), Combs
patent: 5666064 (1997-09-01), Kasai et al.
patent: 5843808 (1998-12-01), Karnezos
patent: 5990692 (1999-11-01), Jeong et al.
patent: 6072239 (2000-06-01), Yoneda et al.
patent: 6111324 (2000-08-01), Sheppard et al.
patent: 6159770 (2000-12-01), Tetaka et al.
patent: 6229200 (2001-05-01), McIellan et al.
patent: 6229325 (2001-05-01), Browning et al.
patent: 6242281 (2001-06-01), McIellan et al.
patent: 6284569 (2001-09-01), Sheppard et al.
patent: 6285075 (2001-09-01), Combs et al.
patent: 6294100 (2001-09-01), Fan et al.
patent: 6304000 (2001-10-01), Isshiki et al.
patent: 6326678 (2001-12-01), Karnezos et al.
patent: 6329711 (2001-12-01), Kawahara et al.
patent: 6353263 (2002-03-01), Dotta et al.
patent: 6376921 (2002-04-01), Yoneda et al.
patent: 6392427 (2002-05-01), Yang
patent: 6414385 (2002-07-01), Huang et al.
patent: 6429048 (2002-08-01), McLellan et al.
patent: 6451709 (2002-09-01), Hembree
patent: 6455348 (2002-09-01), Yamaguchi
patent: 6489218 (2002-12-01), Kim et al.
patent: 6498099 (2002-12-01), McLellan et al.
patent: 6507116 (2003-01-01), Caletka et al.
patent: 6545332 (2003-04-01), Huang
patent: 6545347 (2003-04-01), McClellan
patent: 6552417 (2003-04-01), Combs
patent: 6552423 (2003-04-01), Song et al.
patent: 6552560 (2003-04-01), Melgaard et al.
patent: 6566740 (2003-05-01), Yasunaga et al.
patent: 6573121 (2003-06-01), Yoneda et al.
patent: 6585905 (2003-07-01), Fan et al.
patent: 6586834 (2003-07-01), Sze et al.
patent: 6635957 (2003-10-01), Kwan et al.
patent: 6667191 (2003-12-01), McLellan et al.
patent: 6686667 (2004-02-01), Chen et al.
patent: 6703696 (2004-03-01), Ikenaga et al.
patent: 6709877 (2004-03-01), Tsui et al.
patent: 6724071 (2004-04-01), Combs
patent: 6734044 (2004-05-01), Fan et al.
patent: 6734552 (2004-05-01), Combs et al.
patent: 6737755 (2004-05-01), McLellan et al.
patent: 6764880 (2004-07-01), Wu et al.
patent: 6781242 (2004-08-01), Fan et al.
patent: 6790710 (2004-09-01), McLellan et al.
patent: 6800948 (2004-10-01), Fan et al.
patent: 6812552 (2004-11-01), Islam et al.
patent: 6818472 (2004-11-01), Fan et al.
patent: 6818978 (2004-11-01), Fan
patent: 6818980 (2004-11-01), Pedron, Jr.
patent: 6821817 (2004-11-01), Thamby et al.
patent: 6841859 (2005-01-01), Thamby et al.
patent: 6872661 (2005-03-01), Kwan et al.
patent: 6876066 (2005-04-01), Fee et al.
patent: 6897428 (2005-05-01), Minamio et al.
patent: 6903304 (2005-06-01), McLellan et al.
patent: 6933176 (2005-08-01), Kirloskar et al.
patent: 6933594 (2005-08-01), McLellan et al.
patent: 6940154 (2005-09-01), Pedron et al.
patent: 6946324 (2005-09-01), McLellan et al.
patent: 6964918 (2005-11-01), Fan et al.
patent: 6967126 (2005-11-01), Lee et al.
patent: 6979594 (2005-12-01), Fan et al.
patent: 6982491 (2006-01-01), Fan et al.
patent: 6984785 (2006-01-01), Diao et al.
patent: 6989294 (2006-01-01), McLellan et al.
patent: 6995460 (2006-02-01), McLellan et al.
patent: 7008825 (2006-03-01), Bancod et al.
patent: 7009286 (2006-03-01), Kirloskar et al.
patent: 7015072 (2006-03-01), Combs et al.
patent: 7049177 (2006-05-01), Fan et al.
patent: 7060535 (2006-06-01), Sirinorakul
patent: 7071545 (2006-07-01), Patel et al.
patent: 7081403 (2006-07-01), Kirloskar et al.
patent: 7091581 (2006-08-01), McLellan et al.
patent: 7101210 (2006-09-01), Lin et al.
patent: 7102210 (2006-09-01), Ichikawa
patent: 7205178 (2007-04-01), Shiu et al.
patent: 7224048 (2007-05-01), McLellan et al.
patent: 7226811 (2007-06-01), McLellan et al.
patent: 7232755 (2007-06-01), McLellan et al.
patent: 7247526 (2007-07-01), Fan et al.
patent: 7270867 (2007-09-01), Kwan et al.
patent: 7271032 (2007-09-01), McLellan et al.
patent: 7274088 (2007-09-01), Wu et al.
patent: 7314820 (2008-01-01), Lin et al.
patent: 7315080 (2008-01-01), Fan et al.
patent: 7342305 (2008-03-01), Diao et al.
patent: 7344920 (2008-03-01), Kirloskar et al.
patent: 7348663 (2008-03-01), Kirloskar et al.
patent: 7358119 (2008-04-01), McLellan et al.
patent: 7371610 (2008-05-01), Fan et al.
patent: 7372151 (2008-05-01), Fan et al.
patent: 7381588 (2008-06-01), Patel et al.
patent: 7399658 (2008-07-01), Shim et al.
patent: 7408251 (2008-08-01), Hata et al.
patent: 7411289 (2008-08-01), McLellan et al.
patent: 7449771 (2008-11-01), Fan et al.
patent: 7482690 (2009-01-01), Fan et al.
patent: 7595225 (2009-09-01), Fan et al.
patent: 7714418 (2010-05-01), Lim et al.
patent: 2003/0006055 (2003-01-01), Chien-Hung et al.
patent: 2003/0045032 (2003-03-01), Abe
patent: 2003/0071333 (2003-04-01), Matsuzawa
patent: 2003/0143776 (2003-07-01), Pedron, Jr. et al.
patent: 2003/0178719 (2003-09-01), Combs et al.
patent: 2003/0201520 (2003-10-01), Knapp et al.
patent: 2003/0207498 (2003-11-01), Islam et al.
patent: 2004/0014257 (2004-01-01), Kim et al.
patent: 2004/0046237 (2004-03-01), Abe et al.
patent: 2004/0046241 (2004-03-01), Combs et al.
patent: 2004/0080025 (2004-04-01), Kasahara et al.
patent: 2004/0110319 (2004-06-01), Fukutomi et al.
patent: 2005/0003586 (2005-01-01), Shimanuki et al.
patent: 2005/0077613 (2005-04-01), McLellan et al.
patent: 2006/0192295 (2006-08-01), Lee et al.
patent: 2006/0223229 (2006-10-01), Kirloskar et al.
patent: 2006/0223237 (2006-10-01), Combs et al.
patent: 2006/0273433 (2006-12-01), Itou et al.
patent: 2007/0001278 (2007-01-01), Jeon et al.
patent: 2007/0200210 (2007-08-01), Zhao et al.
patent: 2007/0235217 (2007-10-01), Workman
patent: 2008/0048308 (2008-02-01), Lam
patent: 2008/0150094 (2008-06-01), Anderson
U.S. Appl. No. 11/413,408, filed Apr. 27, 2006, Saruch Sangaunwong et al.
U.S. Appl. No. 12/080,676, filed Apr. 4, 2008, Saruch Sangaunwong et al.
U.S. Appl. No. 12/080,677, filed Apr. 4, 2008, Saruch Sangaunwong et al.
U.S. Appl. No. 12/290,188, filed Oct. 27, 2008, Saravuth Sirinorakul et al.
U.S. Appl. No. 60/001,961, filed Nov. 5, 2007, Saravuth Sirinorakul et al.
Notice of Allowance dated Dec. 2, 2009, U.S. Appl. No. 12/080,677, filed Apr. 4, 2008, Saruch Sangaunwong.
U.S. Appl. No. 11/899,189, Saravuth Sirinorakul et al.
U.S. Appl. No. 12/231,710, Saravuth Sirinorakul et al.
U.S. Appl. No. 12/287,174, Saravuth Sirinorakul et al.
U.S. Appl. No. 12/378,119, Somchai Nondhasitthichai et al.
U.S. Appl. No. 12/383,135, Somchai Nondhasitthichai et al.
U.S. Appl. No. 11/413,408, Saruch Sangaunwong et al.

Affiliated with

Also associated with

Rating

Method and apparatus for no lead semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for no lead semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for no lead semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4310166