Method and apparatus for plating a semiconductor package

Details Method and apparatus for plating a semiconductor package Method and apparatus for plating a semiconductor package

2011-04-12

2011-04-12

Bell, Bruce F (Department: 1759)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S212000, C204S22400M, C204S242000, C204S273000

Reexamination Certificate

active

07922877

ABSTRACT:
A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.

REFERENCES:
patent: 5441620 (1995-08-01), Nishimura et al.
patent: 5498325 (1996-03-01), Nishimura et al.
patent: 6261433 (2001-07-01), Landau

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