Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
An electronic package that has a die coupled to a lead frame by
Method of controlling solder ball size of BGA IC components
Short power signal path integrated circuit package
Staggered land pad pattern on substrate for tab interconnection
Standardized power and ground design for pin grid array packages
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Profile ID: LFUS-PAI-P-1378900