4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Combined with coating step

Shouli Steve Hsia

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Metal interconnect stack for integrated circuit structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Method for shallow trench isolations with chemical-mechanical po

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Patent

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Modified multilayered metal line structure for use with tungsten

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Process for forming metal interconnect stack for integrated...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Process for forming vias, and trenches for metal lines, in multi

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Patent

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Profile ID: LFUS-PAI-P-321580

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