4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Smart card package

Shojiro Kodai

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active

IC card and manufacturing method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent

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Method for manufacturing an encapsulated IC card having a molded

Fishing – trapping – and vermin destroying
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Molded IC card

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
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Profile ID: LFUS-PAI-P-28229

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