Method for manufacturing an encapsulated IC card having a molded

Details Method for manufacturing an encapsulated IC card having a molded Method for manufacturing an encapsulated IC card having a molded

1992-10-20

1993-09-14

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437219, 235492, 257679, H01L 2152, H01L 2154, H01L 2156, H01L 2158

Patent

active

052448401

ABSTRACT:
A method for manufacturing an integrated circuit card by providing a circuit board having electronic components mounted thereon intermediate the thickness of a molded frame and filling the frame with resin in a mold so that the resin passes through an opening in the circuit board and seals both sides of the board to a thickness no greater than the frame thickness.

REFERENCES:
patent: 4004133 (1977-01-01), Hannan et al.
patent: 4550248 (1985-10-01), Hoppe et al.
patent: 4569000 (1986-02-01), Noji
patent: 4609970 (1986-09-01), Hilpert
patent: 4611262 (1986-09-01), Galloway et al.
patent: 4695925 (1987-09-01), Kodai et al.
patent: 4709254 (1987-11-01), Haghiri-Tehrani et al.
patent: 4758689 (1988-07-01), Nakao et al.
patent: 4780791 (1988-10-01), Morita et al.
patent: 4822988 (1989-04-01), Gloton
patent: 4961105 (1990-10-01), Yamamoto
patent: 4962415 (1990-10-01), Yamamoto et al.
patent: 4974120 (1990-11-01), Kodai et al.
patent: 4996411 (1991-02-01), Rebjock
patent: 5079673 (1992-01-01), Kodai et al.

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