Molded IC card

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

361392, 361401, 361399, 364708, 235488, 235492, 257687, H05K 114

Patent

active

051738406

ABSTRACT:
An IC card includes a thin plate forming an external surface of the card, a circuit board formed on an internal surface of the thin plate, and a frame surrounding peripheries of the thin plate and the circuit board. A space defined by the frame and the surface plate is filled with molded resin. A portion of an inner peripheral surface of the frame projects into the resin. The molded resin completely covers a surface of the circuit board and integrates the frame and the thin plate.

REFERENCES:
patent: 4682017 (1987-07-01), Nakahara et al.
patent: 4746392 (1988-05-01), Hoppe
patent: 4754319 (1988-06-01), Saito et al.
patent: 4758689 (1988-07-01), Nakao et al.
patent: 4961893 (1990-09-01), Rose
patent: 5030407 (1991-07-01), Mollet et al.

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