4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Shizuki Hashimoto

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Lid for semiconductor package and package having the lid

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Package for holding IC chip

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Semiconductor package using an aluminum nitride substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper
Patent

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Profile ID: LFUS-PAI-P-1449906

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