Package for holding IC chip

Details Package for holding IC chip Package for holding IC chip

1993-12-28

1996-03-05

Nimmo, Morris H.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257700, 361813, H01L 2302

Patent

active

054969670

ABSTRACT:
A package for holding at least one integrated circuit (IC) chip includes an IC chip, a lead frame, and a ceramic relay substrate with a wiring pattern. Respective portions of the wiring pattern are connected to the IC chip and the lead frame by respective bonding wires. The substrate includes at least one green tape with at least part of the wiring pattern thereon, and formed by printing a metal paste on the green tape and then firing it. An opening may be provided in the green tape to receive the IC chip. The assembly, which includes the IC chip, the substrate, and part of the leads of the lead frame, is sealed in a resin molding using a molding technique.

REFERENCES:
patent: 4806188 (1989-02-01), Rellick
patent: 4867935 (1989-09-01), Morrison, Jr.
patent: 5012323 (1991-04-01), Farnworth
patent: 5223741 (1993-06-01), Bechtel

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