Lid for semiconductor package and package having the lid

Details Lid for semiconductor package and package having the lid Lid for semiconductor package and package having the lid

1994-09-06

1995-05-09

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

428637, 428645, H01L 2100

Patent

active

054143004

ABSTRACT:
In a ceramic lid for sealing a semiconductor device mount portion of a ceramic package substrate having a semiconductor device mounted thereon, a seal layer disposed in an outer peripheral edge portion of a lid is formed by a solder comprising 2 to 15 wt % of Bi, 2.0 to 6.0 wt % of Sn, 0.5 to 2.0 wt % of In, 0.5 to 2.0 wt % of Ag and the balance of Pb, through an Ag--Pt system underlying metallized layer. A semiconductor package comprising a semiconductor package substrate and a lid is sealed by the lid.

REFERENCES:
patent: 4356047 (1982-10-01), Gordon et al.
patent: 4487638 (1984-12-01), Hoge
patent: 4746583 (1988-05-01), Falanga
patent: 4833102 (1989-05-01), Bryne et al.

Affiliated with

Also associated with

Rating

Lid for semiconductor package and package having the lid does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lid for semiconductor package and package having the lid, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lid for semiconductor package and package having the lid will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1708193