4. Heat exchange
  5. Intermediate fluent heat exchange material receiving and...
  6. Liquid fluent heat exchange material

Shirley S. Ma

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Direct chip-cooling through liquid vaporization heat exchange

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Patent

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Electronic module adjustment design and process using shims

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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In-situ pad conditioning process for CMP

Abrading – Abrading process – With tool treating or forming
Patent

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Shallow trench isolation (STI) with bilayer of oxide-nitride for

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Patent

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Profile ID: LFUS-PAI-P-762251

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