Abrading – Abrading process – With tool treating or forming
Patent
1998-10-09
2000-02-08
Rose, Robert A.
Abrading
Abrading process
With tool treating or forming
451444, B24B 5300
Patent
active
060222662
ABSTRACT:
An improved method of in-situ conditioning of a polishing pad for use with a stationary pad conditioner during chemical mechanical polishing is described. A polishing table having a polishing pad on its surface is rotated in a first direction during polishing of a semiconductor wafer. A polishing pad conditioner is adjustably attached to the rotating polishing table such that the conditioner is stationary in relation to the rotating polishing table. The conditioner has a roughened surface which is in contact with the polishing pad providing in-situ conditioning during polishing of a semiconductor wafer. After polishing of the semiconductor wafer, the polishing table is rotated in a second direction while the conditioner is still in contact with polishing pad. Rotating the polishing pad in a second direction dislodges the polishing debris clogging the roughened surface of the conditioner and redistributes CMP slurry. The roughened surface of the pad conditioner is refreshed allowing more effective conditioning of the polishing pad. Pad life is prolonged, polishing is stabilized, and the polish cycle time is reduced.
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Bullard Timothy Scott
Lebel Richard John
Nadeau Rock
Smith, Jr. Paul Henry
International Business Machines - Corporation
Ma Shirley S.
Rose Robert A.
Walter, Jr. Howard J.
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