Electronic module adjustment design and process using shims

Details Electronic module adjustment design and process using shims Electronic module adjustment design and process using shims

1998-09-14

2000-04-11

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361715, 257713, 257719, H05K 720

Patent

active

060494565

ABSTRACT:
A thermal conduction module for cooling one or more integrated circuit chips mounted on a substrate is described. At least one shim is disposed between the base plate and the cover plate of the module to establish a predetermined dimension between the cover plate and the integrated circuit chips mounted on the substrate for insertion of a thermal paste. The shims may be metal, engineered plastic, or thermally and electrically conductive or nonconductive creep resistant materials able to withstand the stress and load within the module over time. The shim may be a plurality of shims having the same thickness or a plurality of shims having a multiplicity of thicknesses. Most preferably, the shim conforms to the periphery of the cover plate or base plate. A method of determining the proper shim thickness is also described wherein an initial reading of the thickness of the cover plate and base plate of the module is obtained. A second reading of the thickness of the module is obtained after the substrate, mounted with at least one integrated circuit chip, is placed onto the base plate followed by a temporary spacer and the cover plate. One or more shims are selected which are equal to the difference between the initial reading and the second reading. The cover plate is removed and the spacer is replaced with the appropriate shim. The cover plate is then fastened to the base plate. Also described is a kit for fixing the thermal paste gap dimension in electronic modules comprising a base plate, cover plate, and a plurality of shims having a multiplicity of thicknesses.

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