Direct chip-cooling through liquid vaporization heat exchange

Details Direct chip-cooling through liquid vaporization heat exchange Direct chip-cooling through liquid vaporization heat exchange

1999-03-03

2000-07-11

Lazarus, Ira S.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

165 804, 16510426, 165185, 361700, 174 152, F28D 1500

Patent

active

060858311

ABSTRACT:
An apparatus for and method of cooling an electronic module comprising a heat sink enclosure placed directly over a chip or substrate in a flip chip package. The heat sink enclosure has a plurality of cooling fins extending from within the cavity of the enclosure. A liquid sealed inside the enclosure is trapped within a thermal transfer means, preferably a metal wick, which sits directly on a chip or substrate. As the chip or substrate heats up, heat is transferred to the thermal transfer means which in turn heats the liquid to its heat of vaporization. The vapors of the liquid rise and condense on the cooling fins and the heat is absorbed by the enclosure and conducted to an outside surface of the enclosure and dissipated. Cooling fins on an exterior surface of the enclosure further reduces the thermal resistance to enhance cooling.

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