4. Plastic and nonmetallic article shaping or treating: processes
  5. Direct application of fluid pressure differential to...
  6. Producing multilayer work or article

Shinichi Ohizumi

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Encapsulated semiconductor device having metal foil covering, an

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Process for producing encapsulated semiconductor device having m

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Production method for encapsulating a semiconductor device

Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Producing multilayer work or article
Patent

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Semiconductor device and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Semiconductor sealing epoxy resin composition and...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-329788

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