4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Shimon Neftin

Inventor

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active

Device for electronic packaging, pin jig fixture

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Method of manufacturing a composite structure for use in electro

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Substrate for electronic packaging, pin jig fixture

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1783627

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