4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Shijian Luo

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Electrical condition monitoring method for polymers

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters
Reexamination Certificate

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Electrical condition monitoring method for polymers

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters
Reexamination Certificate

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Electronic devices at the wafer level having front side and...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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High density stacked die assemblies, structures incorporated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Microelectronic device wafers including an in-situ molded...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
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Profile ID: LFUS-PAI-P-2808160

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