Microelectronic device wafers including an in-situ molded...

Details Microelectronic device wafers including an in-situ molded... Microelectronic device wafers including an in-situ molded...

2008-11-26

2010-12-14

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S106000, C438S114000, C438S465000, C438S124000, C438S127000, C257S632000

Reexamination Certificate

active

07851266

ABSTRACT:
A microelectronic device wafer includes an adhesive molded in-situ on the wafer. Adhesives and wafers are positioned in molds and a method that includes drawing in the molds at least a partial vacuum and partially curing the adhesive provides an in-situ molded adhesive that is positioned on the wafer. The adhesives can be in liquid, solid, or other forms prior to molding. During molding, the adhesive can be partially cured by heating or irradiating.

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‘Adhesive’ definition from dictionary.com.
‘Resin’ definition from dictionary.com.

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