4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Shih-Li Chen

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Chip scale package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Electronic device package with enhanced heat dissipation effect

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Fan out type wafer level package structure and method of the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Fan out type wafer level package structure and method of the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Fan out type wafer level package structure and method of the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-774404

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