4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Shih-Ho Lin

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Copper plating of semiconductor devices using single...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Electropolishing method for removing particles from wafer...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating substrate prior to coating
Reexamination Certificate

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Method of forming barrier layer with reduced resistivity and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Test device and method for laser alignment calibration

Optics: measuring and testing – Angle measuring or angular axial alignment – Apex of angle at observing or detecting station
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Profile ID: LFUS-PAI-P-2904958

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