Electropolishing method for removing particles from wafer...

Details Electropolishing method for removing particles from wafer... Electropolishing method for removing particles from wafer...

2006-10-31

2006-10-31

King, Roy (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating substrate prior to coating

C205S219000, C205S660000, C205S684000

Reexamination Certificate

active

07128821

ABSTRACT:
An electropolishing method for removing potential device-contaminating particles from a wafer, is disclosed. The method includes immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction between the wafer and the electrolyte solution in combination with electrolysis. The method is effective in removing particles from via openings of all sizes, including via openings having a width smaller than about 0.2 μm.

REFERENCES:
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 6017437 (2000-01-01), Ting et al.
patent: 6258710 (2001-07-01), Rathore et al.
patent: 6492262 (2002-12-01), Uzoh
patent: 6689686 (2004-02-01), Guldi et al.
patent: 2002/0000382 (2002-01-01), Morrissey et al.
patent: 2002/0056645 (2002-05-01), Taylor et al.
patent: 2003/0201185 (2003-10-01), Bajaj et al.
patent: 2003/0209448 (2003-11-01), Hu et al.
patent: 1440636 (1988-11-01), None
patent: 221315 (2004-09-01), None

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