4. Semiconductor device manufacturing: process
  5. Making device or circuit emissive of nonelectrical signal
  6. Groove formation

Sherif A. Goma

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High density raised stud microjoining system and methods of...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Metalized elastomeric electrical contacts

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Metalized elastomeric probe structure

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Processing for overcoming extreme topography

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Groove formation
Reexamination Certificate

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Silicon chip carrier with conductive through-vias and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2182489

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