4. Cryptography
  5. Cryptanalysis

Sheng-Yuan Lee

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Chip package and electrical connection structure between...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Chip package and electrical connection structure between...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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Circuit board and electronic assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Circuit board and electronic assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Circuit board with mounting pads for reducing parasitic effect

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-87681

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