Circuit board and electronic assembly

Details Circuit board and electronic assembly Circuit board and electronic assembly

2008-05-27

2008-05-27

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S666000

Reexamination Certificate

active

07378743

ABSTRACT:
A circuit board suitable for being electrically connected to a chip package is provided. The chip package has a chip pad and a plurality of inner leads. The circuit board includes at least one patterned conductive layer and at least one insulating layer. The patterned conductive layer has at least one first pad and at least one second pad. The first pad has an extension part and is suitable for being electrically connected to the chip pad. The second pad is suitable for being electrically connected to one end of at least one of the inner leads, while the other end of the inner lead suitable for being electrically connected to the second pad has a projection at least partially overlapping the extension part on the patterned conductive layer. Moreover, the patterned conductive layer is disposed outside the insulating layer.

REFERENCES:
patent: 7211887 (2007-05-01), Channabasappa et al.
patent: 2002/0024129 (2002-02-01), Hirahara et al.
patent: 2005/0082645 (2005-04-01), Lee et al.
patent: 2006/0043542 (2006-03-01), Corisis
patent: 2006/0118924 (2006-06-01), Corisis et al.

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