4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With bumps on ends of lead fingers to connect to semiconductor

Sheila Marie L. Alvarez

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Etched leadframe flipchip package system

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Etched leadframe flipchip package system

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Fabrication method for semiconductor package heat spreaders

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Heat spreaders, heat spreader packages, and fabrication...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Integrated circuit package system employing device stacking

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2374155

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