Etched leadframe flipchip package system

Details Etched leadframe flipchip package system Etched leadframe flipchip package system

2007-07-31

2007-07-31

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23031, C438S108000

Reexamination Certificate

active

11307384

ABSTRACT:
The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.

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