Fabrication method for semiconductor package heat spreaders

Details Fabrication method for semiconductor package heat spreaders Fabrication method for semiconductor package heat spreaders

2003-11-24

2009-08-18

Nguyen, Thanh (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S122000, C438S125000, C257SE21476

Reexamination Certificate

active

07575956

ABSTRACT:
A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.

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