Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-02-06
2007-02-06
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S833000, C029S840000
Reexamination Certificate
active
10956200
ABSTRACT:
An apparatus and method for force mounting semiconductor packages onto printed circuit boards without the use of solder. The apparatus includes a substrate, a first integrated circuit die mounted onto the substrate, a housing configured to house the first integrated circuit die mounted onto the substrate, and a force mechanism configured to force mount the housing including the integrated circuit die and substrate onto a printed circuit board. The method includes mounting a first integrated circuit die onto a first surface of a substrate, housing the first integrated circuit die mounted onto the substrate in a housing, and using a force mechanism to force mount the housing including the first integrated circuit die mounted on the substrate onto a printed circuit board. According to various embodiments, the force mechanism includes one of the following types of force mechanisms clamps, screws, bolts, adhesives, epoxy, or Instrument housings or heat stakes.
REFERENCES:
patent: 419466 (1890-01-01), McIntire et al.
patent: 3509270 (1970-04-01), Yorgensen et al.
patent: 3816847 (1974-06-01), Nagao
patent: 4055761 (1977-10-01), Shimomura
patent: RE31114 (1982-12-01), Berg
patent: 4400234 (1983-08-01), Berg
patent: 4410223 (1983-10-01), Baker
patent: 4917466 (1990-04-01), Nakamura et al.
patent: 5005106 (1991-04-01), Kiku
patent: 5031076 (1991-07-01), Kiku
patent: 5273440 (1993-12-01), Ashman et al.
patent: 5306948 (1994-04-01), Yamada et al.
patent: 5348686 (1994-09-01), Vyas
patent: 5383787 (1995-01-01), Switky et al.
patent: 5396403 (1995-03-01), Patel
patent: 5413489 (1995-05-01), Switky
patent: 5515604 (1996-05-01), Horine et al.
patent: 5764409 (1998-06-01), Colvin
patent: 5821532 (1998-10-01), Beaman et al.
patent: 6016254 (2000-01-01), Pfaff
patent: 6069482 (2000-05-01), Hilton
patent: 6078500 (2000-06-01), Beaman et al.
patent: 6081429 (2000-06-01), Barrett
patent: 6130448 (2000-10-01), Bauer et al.
patent: 6156484 (2000-12-01), Bassous et al.
patent: 6188841 (2001-02-01), Kamata
patent: 6204455 (2001-03-01), Gilleo et al.
patent: 6362637 (2002-03-01), Farnworth et al.
patent: 6390826 (2002-05-01), Affolter et al.
patent: 6393116 (2002-05-01), Kaiser et al.
patent: 6409521 (2002-06-01), Rathburn
patent: 6428650 (2002-08-01), Chung
patent: 6441485 (2002-08-01), Glenn
patent: 6476625 (2002-11-01), Do
patent: 6489788 (2002-12-01), Sausen
patent: 6501658 (2002-12-01), Pearson et al.
patent: 6506978 (2003-01-01), Furihata
patent: 6525555 (2003-02-01), Khandros et al.
patent: 6627872 (2003-09-01), Fukamura et al.
patent: 6629363 (2003-10-01), Chan
patent: 6646289 (2003-11-01), Badehi
patent: 6649991 (2003-11-01), Chen et al.
patent: 6686667 (2004-02-01), Chen et al.
patent: 6690184 (2004-02-01), Akram
patent: 6695623 (2004-02-01), Brodsky et al.
patent: 6823582 (2004-11-01), Mostafazadeh et al.
patent: 2001/0000295 (2001-04-01), Farnworth et al.
patent: 2001/0040460 (2001-11-01), Beaman et al.
patent: 2002/0011859 (2002-01-01), Smith et al.
patent: 2002/0057468 (2002-05-01), Segawa et al.
patent: 2002/0060579 (2002-05-01), Haseyama et al.
patent: 2002/0070448 (2002-06-01), Gonzalez et al.
patent: 2002/0113958 (2002-08-01), Wilsher et al.
patent: 2002/0117330 (2002-08-01), Eldridge et al.
patent: 2002/0182900 (2002-12-01), Brodsky et al.
patent: 2003/0000739 (2003-01-01), Frutschy et al.
patent: 2003/0040139 (2003-02-01), Canella
patent: 2003/0042595 (2003-03-01), Canella
patent: 2003/0222333 (2003-12-01), Bolken et al.
patent: 2004/0048497 (2004-03-01), Hougham
“Chip Scale Review Online”, downloaded from http://www.chipscalereview.com/issues/0900/techTrends.html, May 21, 2002.
Mostafazadeh Shahram
Smith Joseph O.
Arbes Carl J.
Beyer Weaver & Thomas LLP
National Semiconductor Corporation
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