New IC molding process

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds

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Details

4251261, 425127, 4251291, 425258, 425544, B29C 4518

Patent

active

048121142

ABSTRACT:
A molding system and process is disclosed to interface with existing wire bonders using a single track design from the bonder through the molding process. During the molding operation, the bonded lead frame is transferred into the mold on a guide track system built into the mold chase. The mold closes and clamps the lead frame after which a compound charging system meters and injects a compound into the mold cavities. The mold is opened and the strip ejected and transferred out of the mold via internal guide tracks. A granular or pellet form of compound is use in the charging system.

REFERENCES:
patent: 3973888 (1976-08-01), Hehl
patent: 4402657 (1983-09-01), Laghi
patent: 4752198 (1988-06-01), Boschman

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