Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2011-05-31
2011-05-31
Jackson, Jr., Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S737000, C257S774000, C257SE23021, C257SE23067, C257SE23069, C174S262000, C174S263000, C174S267000
Reexamination Certificate
active
07952199
ABSTRACT:
A circuit board and a semiconductor package having the same are provided. The circuit board comprises a base substrate having interconnections, and solder ball lands disposed on one surface of the base substrate. The solder ball lands respectively have land holes having different sizes. The land hole disposed at the center portion of the base substrate and the land hole disposed at the edge portion of the base substrate may have different sizes. For example, the sizes of the land holes may increase from the center portion of the base substrate to the edge portion thereof, and alternatively, the sizes of the land holes may decrease from the center portion of the base substrate to the edge portion thereof.
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Jo Sang-Gui
Mok Seung-Kon
Youn Han-Shin
Chen Yu
Jackson, Jr. Jerome
Muir Patent Consulting, PLLC
Samsung Electronics Co,. Ltd.
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