Circuit board including solder ball land having hole and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Details

C257S737000, C257S774000, C257SE23020, C257SE23021, C257SE23069, C174S263000

Reexamination Certificate

active

07667325

ABSTRACT:
A circuit board and a semiconductor package having the same are provided. The circuit board comprises a base substrate having interconnections, and solder ball lands disposed on one surface of the base substrate. The solder ball lands respectively have land holes having different sizes. The land hole disposed at the center portion of the base substrate and the land hole disposed at the edge portion of the base substrate may have different sizes. For example, the sizes of the land holes may increase from the center portion of the base substrate to the edge portion thereof, and alternatively, the sizes of the land holes may decrease from the center portion of the base substrate to the edge portion thereof.

REFERENCES:
patent: 5872399 (1999-02-01), Lee
patent: 6084781 (2000-07-01), Klein
patent: 6455408 (2002-09-01), Hwang et al.
patent: 2005/0116340 (2005-06-01), Shindo
patent: 2006/0157865 (2006-07-01), Hokari
patent: 07022538 (1995-01-01), None
patent: 10-303330 (1998-11-01), None
patent: 2004-0083192 (2004-10-01), None
English language abstract of Japanese Publication No. 10-303330.
English language abstract of Korean Publication No. 2004-0083192.

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