4. Adhesive bonding and miscellaneous chemical manufacture
  5. Differential fluid etching apparatus
  6. With microwave gas energizing means

Sergey Savastiouk

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Attachment of integrated circuit structures and other...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Attachment of integrated circuit structures and other...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Brim and gas escape for non-contact wafer holder

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate

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Brim and gas escape for non-contact wafer holder

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Dielectric trenches, nickel/tantalum oxide structures, and...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Profile ID: LFUS-PAI-P-2086591

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