4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Solder wettable contact, lead, or bond

Semigear Inc.

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Arrangement for solder bump formation on wafers

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

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Isolation chamber arrangement for serial processing of...

Coating apparatus – Gas or vapor deposition – Multizone chamber
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Isolation chamber arrangement for serial processing of...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate

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