Isolation chamber arrangement for serial processing of...

Details Isolation chamber arrangement for serial processing of... Isolation chamber arrangement for serial processing of...

2006-03-07

2006-03-07

Ghyka, Alexander (Department: 2812)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

C438S800000, C414S935000, C414S939000

Reexamination Certificate

active

07008879

ABSTRACT:
An apparatus for the treatment of semiconductor wafers, comprising a supportive frame and a process table arranged on the supportive frame. The process table comprises a stationary upper platen and a stationary lower plate. An intermediate indexing plate is rotatively arranged between the upper platen and the lower plate. At least one wafer support pin is attached to the indexing plate for the support of a wafer by the indexing plate. An upper housing is arranged on the upper platen and an outer lower housing is arranged on the lower plate. A displacable lower isolation chamber is disposed within the outer lower housing, being displacable against the indexing plate to define a treatment module between the upper housing and the lower isolation chamber in which the wafer is treated. A wafer supporting treatment plate is arranged within the lower isolation chamber, for controlled rapid treatment of a wafer within the treatment module.

REFERENCES:
patent: 5855465 (1999-01-01), Boitnott et al.
patent: 6827789 (2004-12-01), Lee et al.

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