4. Plastic and nonmetallic article shaping or treating: processes
  5. Direct application of fluid pressure differential to...
  6. Producing multilayer work or article

Seishi Oida

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Method for manufacturing resin-molded semiconductor device

Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Producing multilayer work or article
Reexamination Certificate

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Method for manufacturing resin-molded semiconductor device

Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Producing multilayer work or article
Patent

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Resin molded semiconductor device and method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Semiconductor device, semiconductor packaging method,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-355638

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