Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-02-08
2005-02-08
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S771000, C257S772000, C257S782000, C257S783000, C420S557000, C075S255000, C174S050510
Reexamination Certificate
active
06853077
ABSTRACT:
A semiconductor device includes a semiconductor element having a plurality of element electrodes and a ball electrode electrically connected to at least one element electrode out of the plurality of element electrodes. The ball electrode is made of a Sn—Zn-based lead-free solder including 7 through 9.5 wt % of zinc and the remaining of tin.
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Seishi Oida et al., “reliability of Lead-Free Soldering BGA for Law Reflow Temperature”, 8thSymposium on Microjoining and Assembly Technology in Electronics:, pp. 253-256, Jan. 31, 2002.
Copy of International Search Report dated Dec. 25, 2001 for case PCT/JP01/08399.
Jitumori Kenrou
Ohmori Koji
Oida Seishi
Sakaguchi Sigeki
McDermott Will & Emery LLP
Nelms David
Tran Mai-Huong
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