Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-07-12
2005-07-12
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S737000
Reexamination Certificate
active
06917118
ABSTRACT:
On a surface of an electronic component facing a substrate, a plurality of electrode terminals are provided which are of circular plane shapes. On regions of the main surface of the substrate facing the electrode terminals, a plurality of interconnect electrodes are provided which are of circular plane shapes.
REFERENCES:
patent: 6334905 (2002-01-01), Hanawa et al.
patent: 6784086 (2004-08-01), Ray et al.
patent: 10-12773 (1998-01-01), None
Nakazawa Toshiyuki
Ogawa Takashi
Oida Seishi
Omori Kouji
Sakaguchi Shigeki
McDermott Will & Emery LLP
Potter Roy
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