Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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C257S737000

Reexamination Certificate

active

06917118

ABSTRACT:
On a surface of an electronic component facing a substrate, a plurality of electrode terminals are provided which are of circular plane shapes. On regions of the main surface of the substrate facing the electrode terminals, a plurality of interconnect electrodes are provided which are of circular plane shapes.

REFERENCES:
patent: 6334905 (2002-01-01), Hanawa et al.
patent: 6784086 (2004-08-01), Ray et al.
patent: 10-12773 (1998-01-01), None

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